标准名称：BS EN 60749-20-1-2009 Semiconductor devices - Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping
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标准大小：1.73 MB
标准状态：现行
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更新日期：2011年10月26日
内容简介
BS EN 60749-20-1-2009
Semiconductor devices –
Mechanical and climatic
test methods —
Part 20-1: Handling, packing, labelling and
shipping of surface-mount devices sensitive
to the combined effect of moisture and
soldering heat
Semiconductor devices –
Mechanical and climatic
test methods —
Part 20-1: Handling, packing, labelling and
shipping of surface-mount devices sensitive
to the combined effect of moisture and
soldering heat
